Mwambo 4-wosanjikiza Black Soldermask PCB ndi BGA

BGAs (Mpira Grid Arrays) ndi zigawo za SMD zolumikizana pansi pa gawolo. Pini iliyonse imaperekedwa ndi mpira wa solder. Zolumikizira zonse zimagawidwa mu gridi yofananira pamwamba kapena matrix pagawo.

Ma board a BGA ali ndi zolumikizira zambiri kuposa ma PCB abwinobwino, kulola ma PCB ang'onoang'ono, ocheperako. Popeza zikhomo zili pansi pa bolodi, zotsogolazo zimakhala zazifupi, zomwe zimapangitsa kuti zikhale bwino komanso zimagwira ntchito mofulumira.

Zigawo za BGA zili ndi malo omwe azidzigwirizanitsa okha pamene solder imasungunuka ndikuwumitsa zomwe zimathandiza ndi kuyika kopanda ungwiro.. chigawocho ndi usavutike mtima kulumikiza kutsogolera kwa PCB. Phiri lingagwiritsidwe ntchito kusunga malo a chigawocho ngati soldering ikuchitika ndi manja.

BGA phukusi kuperekakachulukidwe kakang'ono ka pini, kutsika kwamafuta, komanso kutsika kwamphamvukuposa mitundu ina ya paketi. Izi zikutanthawuza zikhomo zambiri zolumikizirana ndikuwonjezera magwiridwe antchito pa liwiro lalitali poyerekeza ndi mapaketi apawiri am'mizere kapena osalala. BGA ilibe zovuta zake, komabe.

Ma BGA ICs ndizovuta kuziwona chifukwa cha zikhomo zobisika pansi pa phukusi kapena thupi la IC. Chifukwa chake kuyang'ana kowoneka sikutheka ndipo de-soldering ndizovuta. The BGA IC solder olowa ndi PCB pad amakonda flexural kupsinjika ndi kutopa komwe kumabwera chifukwa cha kutenthetsera panjira mu reflow soldering process.